![]() The system expansion for the Consequential LCA (CLCA) did not change this conclusion. This study confirms earlier similar ALCAs. ![]() resource consumption, global warming and ozonelayer depletion are presented and discussed.įindings – The attributional LCA (ALCA) results point towards a larger impact for Sn95.5Ag3.8Cu0.7 than Sn63Pb37 mostly due to the higher Sn and Ag content. The LIME results based on three environmental impact categories, i.e. Purpose – Using two different conceptual approaches to environmental life-cycle assessment, attributional and consequential, the purpose was to test the hypothesis that a typical lead free solder paste Sn95.5Ag3.8Cu0.7 is worse than Sn63Pb37 as far as global environmental impacts are concerned.ĭesign/methodology/approach – Single index weighting indices within the impact methodology Life cycle Impact Assessment Method based on Endpoint Modelling (LIME) impact methodology, were applied to the flows of three life cycle inventory models and their globally related flows. Study comparing 10Sn90Pb solder paste and silver-epoxy ICA including platings has been reported. ![]() The value of the present study is that so far no LIME-based life cycle impact assessment case Metal production data and end-of-life scenario. The most important research limitations are the representativity of the Overall, the results are dominated by various lead emissions, the silver resourceĬonsumption, and the sulfur oxide emissions from palladium production. For surface platings palladium dominates the results. ![]() The silver containing adhesive, excluding platings, are superior to the 10Sn90Pb, and that trade-offs exist between 10Sn90Pb and silver-epoxy Results are evaluated using the Life cycle Impact assessment Method based on Endpoint modeling (LIME) methodology. ![]() The study is done from a life cycle perspective in Japan using input data from literature and the inventory The purpose of the present research is to compare the 10Sn90Pb solder paste to an epoxy based isotropically conductiveĪdhesive (ICA) containing pure silver. Conductive adhesives are getting growing attention in the electronics industry as they constitute an alternative to lead-free solders andĬonventional solders. ![]()
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